| 序号 | 标准号 | 标准名称 |
 1 | PC-M-106 | Technology Reference for Design Manual 设计技术手册 |
| 2 | IPC-2220 | Design Standard Series 设计标准系列手册 |
| 3 | IPC-D-317A | Design Guidelines for Electronic Packaging Utilizing High Speed Techniques采用高速技术电子封装设计导则 |
| 4 | IPC-M-102 | Flexible Circuits Compendium 挠性电路纲要 |
| 5 | IPC-4202 | Flexible Base Dielectrics for Use in Flexible Printed Circuitry挠性印制线路用挠性绝缘基底材料 |
| 6 | IPC-4203 | Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films 挠性印制线路覆盖层用涂粘接剂绝缘薄膜 |
| 7 | IPC-4204 | Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry挠性金属箔去电应用于柔性电路组装 |
| 8 | IPC/JPCA-6202 | IPC/JPCA Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards IPC/JPCA单双面挠性印制板性能手册 |
| 9 | IPC-FA-251 | Guidelines for Assembly of Single- and Double-Sided Flex Circuits单面和双面挠性电路组装导则 |
| 10 | IPC-FC-234 | Composite Metallic Materials Specification for Printed Wiring Boards印制线路板复合金属材料规范 |
| 11 | IPC-MB-380 | Guidelines for Molded Interconnection Devices 模压互连器件导则 |
| 12 | IPC-M-107 | Standards for Printed Board Materials Manual 印制板材料标准手册 |
| 13 | IPC-MI-660 | Incoming Inspection of Raw Materials Manual 原材料接收检验手册 |
| 14 | IPC-4101A | Specifications for Base Materials for Rigid and Multilayer Printed Boards刚性及多层印制板用基材规范 |
| 15 | IPC-4121 | Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications 多层印制板用芯板结构选择导则 |
| 16 | IPC-4562 | Metal Foil for Printed Wiring Applications 印制线路用金属箔 |
| 17 | IPC-CF-148A | Resin Coated Metal for Printed Boards 印制板用涂树脂金属箔 |
| 18 | IPC-CF-152B | Composite Metallic Materials Specification for Printed Wiring Boards印制线路板复合金属材料规范 |
| 19 | IPC-TR-482 | New Developments in Thin Copper Foils 薄铜箔的新发展 |
| 20 | IPC-TR-484 | Results of IPC Copper Foil Ductility Round Robin StudyIPC铜箔延展性联合研究结果 |
| 21 | IPC-TR-485 | Results of Copper Foil Rupture Strength Test Round Robin Study铜箔断裂强度试验联合研究结果 |
| 22 | IPC-4412 | Specification for Finished Fabric Woven from ”E” Glass for Printed Boards“E”类精纺玻璃纤维层印制板技术规范 |
| 23 | IPC-4130 | Specification & Characterization Methods for Nonwoven "E" Glass MaterialsE 玻璃纤维非织布材料规范及性能确定方法 |
| 24 | IPC-4110 | Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards印制板用纤维纸规范及性能确定方法 |
| 25 | IPC-4411-K | Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement with Amendment 1 聚芳基酰胺非织布规范及性能确定方法 包括修改单 1 |
| 26 | IPC-4411-AM1 | Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement Amendment 1 关于聚芳基酰胺非织布规范及性能确定方法的修改单 1 |
| 27 | IPC-SG-141 | Specification for Finished Fabric Woven from "S" Glass for Printed Boards印制板用经处理S玻璃纤维织物规范 |
| 28 | IPC-A-142 | Specification for Finished Fabric Woven from Aramid for Printed Boards印制板用经处理聚芳酰胺纤维编织物规范 |
| 29 | IPC-QF-143 | Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards 印制板用经处理石英（熔融纯氧化硅）纤维编织物规范 |
| 30 | IPC-2524 PWB | Fabrication Data Quality Rating System 印制板制造数据质量定级体系 |
| 31 | IPC-9151A | Printed Board Process Capability Quality and Relative Reliability Benchmark Test Standard and Database印制板工艺 容量 质量可靠性试验标准和数据库 |
| 32 | IPC-9191 | General Guidelines for Implementation of Statistical Process Control (SPC) 实施统计过程控制(SPC)的通用导则 |
| 33 | IPC-9199 | Statistical Process Control (SPC) Quality Rating 统计分析控制 |
| 34 | IPC-9252 | Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards 未组装印制板电测试要求和指南 |
| 35 | IT-97061 | PWB Hole to Land Misregistration: Causes and Reliability印制线路板通孔与焊盘的错位: 原因和可靠性 |
| 36 | IT-98103 | Reliability of Misregistered and Landless Innerlayer Interconnects in Thick Panels 多层板内部无焊盘层互连错位的可靠性 |
| 37 | IPC-MS-810 | Guidelines for High Volume Microsection 大批量显微剖切导则 |
| 38 | IPC-QL-653A | Certification of Facilities that Inspect/Test Printed Boards Components & Materials 印制板、元器件及材料检验试验设备的认证 |
| 39 | IPC-TR-483 | Dimensional Stability Testing of Thin Laminates-Report on Phase 1 & 2 International Round Robin Test薄层压板尺寸稳走性试----国际联合试验计划I阶段及II阶段报告 |
| 40 | IPC-TR-486 | Round Robin Study to Correlate IST & Microsectioning Evaluations for Inner-Layer Separation 内层分离的互连应力测试(IST)与显微剖切相关性联合研究 |
| 41 | IPC-T-50F | Terms and Definition for Interconnecting and Packaging Electronic Circuits电子电路互连与封装的定义和术语 |
| 42 | IPC-S-100 | Standards and Specifications Manual标准和详细说明汇编手册 |
| 43 | IPC-E-500 | IPC Electronic Document Collection已出版的IPC标准电子文档资料合订本 |
| 44 | IPC-TM-650 | Test Methods Manual试验方法手册 |
| 45 | IPC-ESD-20-20 | Association Standard for the Development of an ESD Control Program静电释放控制过程(由静电释放协会制定) |
| 46 | IPC/EIA J-STD-001C | Requirements for Soldered Electrical & Electronic Assemblies电气与电子组装件锡焊要求 |
| 47 | IPC-HDBK-001 | Handbook and Guide to Supplement J-STD-001—Includes Amendment 1J-STD-001辅助手册及指南及修改说明1 |
| 48 | IPC-A-610C | Acceptability of Electronic Assemblies印制板组装件验收条件 |
| 49 | IPC-HDBK-610 | Handbook and Guide to IPC-A-610 (Includes IPC-A-610B to C ComparisonIPC-610手册和指南(包括IPC-A-610B和C的对比) |
| 50 | IPC-EA-100-K | Electronic Assembly Reference Set电子组装成套手册，包括：IPC/EIA J-STD-001C，IPC-HDBK-001，IPC-A-610C。 |
| 51 | IPC/WHMA-A-620 | Requirements and Acceptance for Cable and Wire Harness Assemblies电缆和引线贴装的要求和验收 |
| 52 | IPC/EIA J-STD-012 | Implementation of Flip Chip and Chip Scale Technology倒装芯片及芯片级封装技术的应用 |
| 53 | IPC-SM-784 | Guidelines for Chip-on-Board Technology Implementation芯片直装技术实施导则 |
| 54 | IPC/EIA J-STD-026 | Semiconductor Design Standard for Flip Chip Applications倒装芯片用半导体设计标准 |
| 55 | J-STD-027 | Mechanical Outline Standard for Flip Chip and Chip Size ConfigurationsFC（倒装片）和CSP(芯片级封装)的外形轮廓标准 |
| 56 | IPC/EIA J-STD-028 | Performance Standard for Construction of Flip Chip and Chip Scale Bumps 倒装芯片及芯片级凸块结构的性能标准 |
| 57 | SMC-WP-003 | Chip Mounting Technology 芯片贴装技术 |
| 58 | J-STD-013 | Implementation of Ball Grid Array and Other High Density Technology球栅阵列 (BGA)及其它高密度封装技术的应用 |
| 59 | IPC-7095 | Design and Assembly Process Implementation for BGAs球栅阵列的设计与组装过程的实施 |
| 60 | IPC/EIA J-STD-032 | Performance Standard for Ball Grid Array BallsBGA球形凸点的标准规范 |
| 61 | IT-98000 JPL | Chip Scale Packaging GuidelinesJPL 发布的CSP导则注： |
| 62 | IT-98080 JPL | Ball Grid Array Packaging GuidelinesJPL 发布的BGA封装导则 |
| 63 | IT-98093 ITRI | Chip Carrier Phase 1 ReportITRI 关于芯片载体的报告ITRI (The Interconnect Technology Research Institute) |
| 64 | IPC-MC-790 | Guidelines for Multichip Module Technology Utilization多芯片组件技术应用导则 |
| 65 | IPC-M-108 | Cleaning Guides and Handbook Manual 清洗导则和手册 |
| 66 | IPC-TP-1113 | Circuit Board Ionic Cleanliness Measurement: What Does It Tell Us电路板离子洁净度测量：它告诉我们什么？ |
| 67 | IPC-CH-65A | Guidelines for Cleaning of Printed Boards & Assemblies印制板及组装件清洗导则 |
| 68 | IPC-SC-60A | Post Solder Solvent Cleaning Handbook 锡焊后溶剂清洗手册 |
| 69 | IPC-SA-61 | Post Solder Semi-aqueous Cleaning Handbook 锡焊后半水溶剂清洗手册 |
| 70 | IPC-AC-62A | Aqueous Post Solder Cleaning Handbook 锡焊后水溶液清洗手册 |
| 71 | IPC-TR-476A | Electrochemical Migration: Electrically Induced Failures in Printed Circuit Assemblies 电化学迁移：印制电路组件的电气诱发故障 |
| 72 | IPC-TR-580 | Cleaning and Cleanliness Test Program Phase 1 Test Results清洗及清洁度试验计划1阶段试验结果 |
| 73 | IPC-TR-582 | Cleaning and Cleanliness Test Program for: Phase 3 --Low Solids Fluxes and Pastes Processed in Ambient Air IPC第3阶段非清洗助焊剂研究 |
| 74 | IPC-TR-583 | An In-Depth Look At Ionic Cleanliness Testing 深入离子洁净度测试 |
| 75 | IPC-9201 | Surface Insulation Resistance Handbook 表面绝缘电阻手册 |
| 76 | IPC-TP-104K | Cleaning & Cleanliness Test Program Phase 3 Water Soluble FluxesPart 1 & Part 2第3阶段水溶性助焊剂清洗，第一和第二部分 |
| 77 | IPC-M-109 | Component Handling Manual 元件处理手册 |
| 78 | IPC/JEDEC J-STD-020B | Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices 非密封固态表面贴装器件湿度／再流焊敏感度分类 |
| 79 | IPC/JEDEC J-STD-033A | Handling Packing Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices 对湿度、再流焊敏感表面贴装器件的处置、包装、发运和使用 |
| 80 | IPC/JEDEC J-STD-035 | Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components 非气密封装电子元件用声波显微镜 |
| 81 | IPC-9500-K | Set of four documents 9501-9504 9501至9504手册合订本 |
| 82 | IPC-DRM-18F | Component Identification Desk Reference Manual 零件分类标识手册 |
| 83 | IPC-DRM-SMT-C | Surface Mount Solder Joint Evaluation Desk Reference Manual接插件焊接点评价手册 |
| 84 | IPC-DRM-40E | Through-Hole Solder Joint Evaluation Desk Reference Manual接插件焊接点评价手册 |
| 85 | IPC-DRM-56 | Wire Preparation & Crimping Desk Reference Manual导线和端子预成形参考手册 |
| 86 | IPC-DRM-53 | Introduction to Electronics Assembly Desk Reference Manual电子组装基础介绍手册 |
| 87 | IPC-SM-785 | Guidelines for Accelerated Reliability Testing of Surface Mount Attachments表面安装焊接件加速可靠性试验导则 |
| 88 | IPC-SM-780 | Component Packaging and Interconnecting with Emphasis on Surface Mounting以表面安装为主的元件封装及互连导则 |
| 89 | IPC-TA-724 | Technology Assessment Series on Clean Rooms 清洁室技术精选系列 |
| 90 | IPC-TA-723 | Technology Assessment Handbook on Surface Mounting表面安装技术精选手册 |
| 91 | IPC-TA-722 | Technology Assessment of Soldering 锡焊技术精选手册 |
| 92 | IPC-M-104 | Standards for Printed Board Assembly Manual 10种常用印制板组装标准合订本 |
| 93 | IPC-M-103 | Standards for Surface Mount Assemblies Manual 所有SMT标准合订本 |
| 94 | IPC-PD-335 | Electronic Packaging Handbook 电子封装手册 |
| 95 | IPC-7525 | Stencil Design Guidelines 网版设计导则 |
| 96 | IPC-TR-581 | IPC Phase III Controlled Atmosphere Soldering Study IPC第3阶段受控气氛焊接研究 |
| 97 | IPC/EIA J-STD-004 | Requirements for Soldering Fluxes-Includes Amendment 1锡焊焊剂要求（包括修改单1） |
| 98 | IPC/EIA J-STD-005 | Requirements for Soldering Pastes-Includes Amendment 1焊膏技术要求（包括修改单1） |
| 99 | IPC-HDBK-005 | Guide to Solder Paste Assessment 焊膏性能评价手册 |
| 100 | IPC/EIA J-STD-006A | Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders 电子设备用电子级锡焊合金、带焊剂及不带剂整体焊料技术要求 |